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2D MEMS Probe to Parametric Testing-SWTestAsia2019
2021-12-11
2D MEMS Probe to Parametric Testing and Other Probe Technology
Overview
• Introduction
• History of Parametric Probe Card
• Objective
• 2D MEMS Probe to Parametric Test
• Customer Evaluation Results
• Probe Technology Comparison for Parametric Testing
• Summary
Introduction
• Parametric Testing(WAT; Wafer Acceptance Test) is unique application for probe card suppliers
– Basically similar and simple probe layout – 1 or 2 lines, 10 – 100 probes
– NO device type specific test – DRAM, NAND, SoC, Logic, CIS
– Each semiconductor company has each special requirement
– Circuit, Test condition, Pad size, material and treatment, Sample size and etc
– Many different Probe technologies are available by each probe card supplier
• Formfactor also providing many probe technology
• Added 1 more probe technology to Parametric card – 2D-MEMS, T18
Objective
evaluation by A Semiconductor company.
• Introducing T18, 2D-MEM Cantilever type spring under probe
• Evaluation is showing some difference from 3D-MEMS type technology choice for Semiconductor company
• Hopefully this presentation will be one of guidance for probe
– Excess OD capability img21 Absorb thermal Z movement with ease of use
T18, 2D-MEMS Probe to Parametric
developed for NAND Flash probe card
• Formfactor T18, 2D-MEMS Cantilever type spring was originally
– Take advantage from Cantilever type and Vertical type
– Low Scrub Ratio; 4% OD with saturating
– Less Particle generation
– Excess Over Travel capability; 250um Max OD
– Low Scrub Ratio img22 Stay in Small pad(<30um) with ease of use
– Less Particle generation img23 Good for everybody
• Potentially good for Parametric Probe Card !?
2D-MEMS and 3D-MEMS Difference
• 2D and 3D Comparison for some important factors
T18, 2D-MEMS Item T11.2, 3D-MEMS | ||
Square Pole | Probe Tip Shape/Size | Truncated Pyramid |
+/-5um | Tip Placement Accuracy | +/-5um |
Fixed - 35-50um | Spring Body - Width | Tapered – More Robust |
PA-II | Tip Material | PA-II |
4% Saturating - Smaller | Scrub Ratio | 10% Linear |
250um - Larger | Maximum Over Travel | 150um |
Author
T18,2D-MEMS Probe Tip
•2D-MEMS Tip Shape maintains same tip size for life
–Polishing probe tips by Abrasive cleaning will not change the tip X&Y size
Angled View
-T18,2D
Side View
-T18,2D
•T11,3D-MEMS Pyramid Shape
–6x6um tip size increases by tip wear and abrasive cleaning
–Scrub mark size also increases
–#Recent ITS Waffle cleaning maintains tip size small by aggressive cleaning and rounding tip
Author
Top View–T11,3D
T18,2D-MEMS Scrub Ratio and Force
•Spring constant(K-value);0.6–0.8[g/mil]decreasing at high OD
•Scrub Ratio;~4%with decreasing at high OD
Author
T18, 2D-MEMS – Low Electrical Leakage
Tester; Agilent 4156C
Measured voltage: 10V (100V)
Temperature: 23+/-5C
Humidity: 50+/- 10% Measurement pin count: 48 ch Measurement setting time: 1sec, 10sec
3D-MEMS, T11 - Takumi
@ 1 sec settling
@ 10 sec settling
2D-MEMS, T18 - Takumi-CL
•2D-MEMS&3D-MEMS probe card both showed equivalent low
requires experienced design and material selection
•MEMS type leakage performance rely on substrate and PCB,which
Author 11
T18,2D-MEMS–Low Parasitic(Stray)Capacitance
ester; Agilent E4980A Measured voltage: 1V Measurement frequency: 1MHz Temperature: 23+/-5C Humidity: 50+/-10% Measurement pin count: 48 ch
Typical Cantilever Probe Card
2D-MEMS, T18
Takumi-CL
•2D-MEMS probe card showed low stray capacitance equivalent with 3D-
MEMS stable mechanical performance and realize consistent electrical
•Careful Substrate design and material selection are important to utilize
performance.
Customer Evaluation Results
with actual wafers
•A semiconductor company has been evaluating T18 probe card
Contact performance with actual wafer,which varies with pad
•Important to evaluate the actual Scrub mark size and Electrical
metallization condition
Author 12
–Scrub Mark Size,T18,2D-MEMS
Customer Evaluation Results
–Saturated Scrub Mark Size;8 x 13um(NSxS direction)
•Scrub Mark Size saturated on actual customer wafer also
Customer Evaluation Results
• Customer Special Requirement: Prow Height
T18,2D-MEMS
T18,2D-MEMS
T3,3D-MEMS
T3,3D-MEMS
Prow height limitation
proportional increase
saturated prow height and
•Due to following process,
–T3 type 3D-MEMS showing
–T18 type,2D-MEMS showing
passed customer criteria
required
14
•Evaluation continues
img39Customer Evaluation Results
•Production Overtravel amount was set with 100um with margin
CRES[Ohms]vs.OD[um]
FFI Internal Measurement
Author 15
Customer Evaluation Results
performed with+/-2.5%difference specification on 110 items
•Data Correlation between Cantilever card and T18 card
Author 16
•And passed the correlation test.
Customer Evaluation Results
16 items are caused by other testing root causes.
•16/110 items showed>2.5%spec.And customer confirmed all of
“CRES”this case means“(CRES)+(Path Resistance)x2Ch value
Cantilever Needle | 3D MEMS - T11 | Pyramid Memblene | Vertical MEMS | 2D-MEMS, T18 | ||
| Pad Pitch | >50um | >50um | >50um | >74um | >70um | |
| Layout Capability - 2 Row | 40um | 60um | 60um | 74um | 70um | |
| Probe Tip Size | 10x10 | 4x4 | 8x8um | 10x10um | 10x10um | |
| Tip size growth by tip wear | Yes | Yes | Yes | No | No | |
| Probe Tip Placement Accuracy - X & Y | +/-5um | +/-5um | +/-5um | +/8.5um | +/-5um | |
| Scrub Ratio (% to OD) | Long | Midium | Short | Short | Short | |
| Accuracy durability | +/-10um | +/-5um | +/-5um | +/-8.5um | +/-5um | |
| Pad Size - Production level | >50x50um | >25x25um | >30x30um | >30x30um | >30x30um | |
| Leakage Performance | Moderate - Low | Low | Moderate | Moderate | Low | |
| Path Resistance | Low | Midium | Middium | Midium | Midium | |
| Contact Stability | Moderate | High | High | Moderate | High | |
| RF | Moderate | Moderate | -3dB@40GHz | Moderate | Moderate | |
| Bump wafer parametric | Capable | Height Limit | NA | Capable | Height Limit | |
| Life Time | Moderte | Long | Moderate | Moderate | Moderate | |
| Probe Insert Replaceable | Some | Yes | Yes | Yes | Option | |
| Unit Cost | Low | Moderate | Moderate | Moderate | Moderate | |
| NRE Cost | None | Moderate | Moderate | Moderate | Moderate | |
| New desgin Lead Time | Short | Moderate | Moderate | Moderate | Moderate |
•Each Probe Technology has each strength and weakness
Author
Consideration and Next Step
benefit,Low prow height
•T18,2D-MEMS evaluation with A Customer showed a special
look for other benefits for customer satisfaction
•Continuing customer qualification to optimize the utilization and Semiconductor company.
•Depends on priority,one of characteristics will fit on all
•Will accumulate the experience to find out the fastest way
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